Archivo: Cudeposition

Descripción: Molecular dynamics computer simulation of the deposition of a single copper atom with a kinetic energy of 1 eV on a copper surface. Technical details: cross section of two atom layers in the middle of a larger (10x10x10 unit cells) 3D simulation cell. Simulation made with Sabochick-Lam embedded-atom method potential, Berendsen temperature control used only at the outer boundaries to scale temperature down to 0 K. Initial temperature 0 K (cell prerelaxed to allow for surface relaxation inwards). This kind of processes occur in reality during physical vapour deposition.
Título: Cudeposition
Créditos: Trabajo propio
Autor(a): Knordlun
Términos de Uso: Dominio Público
Licencia: Dominio Público
¿Se exige la atribución?: No